Global Wafer Packaging Industry Expected to Reach $14.1 Billion by 2028 at a CAGR of 17.7% –

DUBLIN–(BUSINESS WIRE)– The “Global Wafer Packaging Market Size, Share and Industry Trend Analysis Report by End User, by Type, by Regional Outlook and Forecast, 2022 – 2028” report has been added to the report offerings.

The global wafer level packaging market size is expected to reach USD 14.1 billion by 2028, growing at a market growth of 17.7% CAGR during the forecast period.

Wafer level packaging (WLP) is a technique of connecting packaging elements to an integrated circuit before cutting it. Unlike the traditional approach, which involves cutting the board into individual circuits before attaching the packaging components, this procedure does not involve cutting the board into distinct circuits.

Factors such as increased use of high speed, compact size and less expensive electronic products are expected to propel the global wafer level packaging business. In addition, the technological superiority of wafer-level packaging over traditional packaging approaches, as well as the approaching requirement for circuit reduction in microelectronic devices, is driving the market growth. Additionally, the increased use of wafers in the automotive industry is anticipated to boost the market.

Wafer-level packaging involves expanding wafer fabrication methods to include device connectivity and protection. Most alternative types of packaging begin with die cutting and then placing the individual die in a plastic box with solder bumps attached.

Board-level packaging involves attaching the bottom and top outer layers of the package, as well as the solder bumps, to the ICs while the board is still in the board and then cutting the boards. There is currently no industry standard approach to wafer-level packaging. Due to their small size, mobile phones are a popular application for WLP.

Due to rapid advances in integrated circuit manufacturing processes, fans in wafer-level packaging solutions are becoming increasingly important in the semiconductor packaging area. Moreover, one of the main factors driving the wafer-level packaging solutions market is the demand for faster, lighter, smaller and more cost-effective electronic equipment with high performance as well as low-cost packaging.

WLP can be found in consumer electronics such as mobile phones and other semiconductor devices, as well as in integrated circuits. One of the main elements driving the demand for wafer-level packaging technology over traditional packaging solutions is the growing demand for technical improvement of mobile devices that are capable of completing a variety of programs in a single small end product.

Market Growth Factors

Cost effective and time efficient

Electrical testing is less expensive and takes less time because these programs were designed with DFT in mind. Because the connections are exposed on the wafer, advanced fabs can automate this procedure and testing is not required after packaging. Combustion testing is also accelerated due to the use of a single wafer.

The IC verification method includes two critical steps, including reliability evaluation and functional testing. Board-level packaging was not specifically designed to improve DFT, but it undoubtedly helps because it exposes critical test locations and interconnects directly on the board.

Optimizes temperature control

When the casting solutions effectively exit the film, the humidification rates can be better controlled. Controlled and regulated temperature ramp rates provide an improved system window for optimal curing of the polyimide film. When using multiple layers of polyimide, optimal temperature control is very important.

Due to stress, improper curing can cause the first layer of polyimide to soften and metal lines to multiply. Oxygen absorption in polyimide can result in a dark, brittle coating. Vacuum / N2 cycles generate an oxygen-free environment for curing. The diameter of the intermediate wafer determines the investment and production infrastructure in traditional WLCSP processing.

Market Restraining Factors

High initial investment requirement

Various wafer-level packaging, or WLP, technologies are currently being introduced to the market at an extremely high altitude, especially in portable and mobile applications. In recent years, a considerable number of wafer-level packaging units have been installed in smartphones, tablet PCs, and portable gadgets, indicating significant growth in the wafer-level packaging industry.

However, there are several challenges that are posed to the market players operating in this sector. one of the major challenges is that wafer-level packaging requires a higher capital investment than traditional flip-chip and wire packaging because it uses fab-like tooling for the redistribution process using thin-film metals and dielectric polymers. Cost reduction is a significant aspect of expanding the market beyond current limitations.

Scope of the study

Market segments covered in the report:

By the end user

  • Consumer electronics

  • cars

  • Health

  • IT and telecommunications

  • Others

By Type


  • 5D TSV WLP

  • 3D TSV WLP

  • Nano WLP

  • Others

Through technology

After Geography

  • North America

  • Europe

  • Asia Pacific


Key players in the market

  • ASML Holding NV

  • Fujitsu Limited

  • Toshiba Corporation

  • Qualcomm, Inc.

  • Amkor Technology, Inc.

  • Deca Technologies, Inc.

  • Jiangsu Changjing Electronics Technology Co., Ltd.

  • Tokyo Electron Ltd.

  • Applied Materials, Inc.

  • Lam Research Corporation

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